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Analysis based on fab defectivity data
Parameters derived from defect data are used to model how defect excursions reduce yield. The parameters include: excursion frequencies, excursion yield impacts, excursion signal to noise ratios, lot-to-lot and wafer-to-wafer variances. The sampling plan and Inspection tool capability parameters are then used to model how excursions can be detected. These include (for each sensitivity setting): throughput, capture rate per defect type, MTBF/MTTR, and sampling (percent of lots, wafers, wafer area, & defects to review). Using these parameters, and more, the Inspection Planner software is used to calculate and minimize total cost.
To learn about typical scope, duration, and tasks go to: Outline of an Inspection Planning project.
Download the product sheet for our Inspection Planning service (pdf).
Learn about the software used to deliver this service.
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