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Inspection Planner 1.0

the excursion risk management tool for   semiconductor fabrication

Technical features of algorithms in IP1.0

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Multi step & product with step dependence

All process and inspection steps can be modeled for multiple products. An inspection tool can sample multiple steps/products. Multiple inspection tools can also sample the same process step. Dependent process steps are not treated independently.

 

Process tool model

If desired, all process tools are modeled explicitly. This makes IP1.0 a regular fab capacity model as well. All tool downtimes are part of queueing calculations.

Multiple defect & excursion types

Each tool cluster and/or process step can have multiple defect types. Each one with its own excursion characteristics. Excursions can impact one or multiple steps/products.

 

Preventive maintenance (PM) impact

Impact of PMs on tool availability and excursion yield losses is captured.

Simultaneous excursions

A process tool cluster can have more than one excursion taking place simultaneously.

 

MTBF/MTTR impact

Non-excursions related MTBF/MTTR of all tools is factored into queueing calculations.

Defect capture rates

Inspection tools have defect specific capture rates (also known as defect detection probabilities).

 

Fab cycle time impact

A dynamic queueing model captures the cycle-time impact of capacity and sampling plans.

Wafer sampling

Wafer sampling can be specified as % of lots, % of wafers, and % of wafer area to inspect.

 

Fab throughput

Fab throughput is a function of capacity and sampling plans.

Review sampling & classification

Excursion detection impact of review percentage and classification accuracy & purity is taken into account.

 

Excursion signal propagation

Excursion signals are seen at probe and can propagate to downstream inspection steps.

Excursion signal to noise & yield impact.

Excursion types have their own signal to noise ratio and yield impact inputs. The data analysis module can provide these inputs.

 

False alarm response, root cause analysis, & excursion fix

These events & their durations impact fab costs, yield, and process tool availability.

Lot-to-lot & wafer-to-wafer variance

These variances impact how many wafers it is necessary to sample per lot.

 

Simulation verification

Analytic approximations used are verified with simulation models for accuracy.

Material handling model

Model has inputs for the travel time lots experience on the material handling system.

 

Optimization capability

A genetic algorithm is used to optimize capacity and sampling plans.

Copyright 2006, Sensor Analytics.